| Author | M. S. Shephard, E. J. Rymaszewski and J. F. McDonald |
|---|---|
| Title | EPII Level-to-Level Analysis of MCM's/Final Report - Executive Summary |
| Year | 1994 |
| Abstract | The objective of this project was to develop a leading-edge, computationally efficient software package for the thermal and thermo-mechanical analysis of multilayer multichip modules (MCM's). The need to explicitly consider the two physical scales of the MCM, the global scale, and the neighborhood of critical areas with features discretely represented, the local scale, dictated that new analysis methodologies be developed. To address this development effort, a three task project was performed. The goal of the first task was the development and seamless integration of the global/local heat conduction and thermo-mechanical analysis of MCM's. The goal of the second task was to develop measurement techniques for use in verifying the predictions of the analysis procedures. The goal of the third task was to link the software developed with leading-edge electromagnetic analysis procedures. |
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