| Author | Mark W. Beall, Atul Garg, Rao Garimella, Ralph B. Iverson, Yannick L. Le Coz, B.-J. Lwo, Ting-Leung Sham, Mark S. Shephard, L.-Y. Song and Vincent S. Wong |
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| Title | REPAS - Rensselaer Electronic Packaging Analysis Software User's Manual |
| Year | 1994 |
| Abstract | The Rensselaer Electronic Packaging Analysis Software (REPAS) is a seamlessly integrated system of global/local thermal and thermomechanical analysis procedures for MCM's, with an interface to an electromagnetic analysis capability. Starting from the common description of the MCM in the Caltech Intermediate Format (CIF) and analysis attribute information specified in a flexible format, the thermal and thermomechanical analysis procedures are automatically executed. These procedures use two different scales of analysis and three different methodologies. Different model building procedures automatically produce the different discretizations required by analyses. A generalized attribute manager ensures the consistency of discretization information and analysis attributes obtained by the analyses, and also coordinates inter-analysis information. |
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