| Author | M.S. Shephard, T.-L. Sham, L.-Y. Song, R. Garimella, H.F. Tiersten, B. J. Lwo, Y. L. Le Coz, R. B. Iverson and J.Fish |
|---|---|
| Title | Global/Local Heat Conduction and Thermomechanical Analyses of Multichip Modules |
| Year | 1994 |
| Pages | - - |
| Editor | - - |
| Abstract | This paper presents a global/local analysis procedure for multichip modules. The global heat conduction and thermomechanical analysis procedures are based on a variational approximation procedure that produces a final system independent of the number of layers. The local heat conduction analysis employs a fast floating random walk method. The local thermomechanical analysis employs automated adaptive finite element modeling techniques. The application of this system to a 25 chip multichip module is demonstrated. Finally, adaptive techniques for controlling multiscale analysis errors are discussed. |
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