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AuthorMark S. Shephard, Ting-Leung Sham, L.-Y. Song, Vincent S. Wong, Rao Garimella, Harry F. Tiersten, B.J. Lwo, Yannick LeCoz, and Ralph B. Iverson
TitleGlobal/Local Analyses of Multichip Modules: Automated 3-D Model Construction and Adaptive Finite Element Analysis
Year1993
Pages39-48
Editor- -
AbstractThe effective design of a multilayer multichip module must account for its thermo-mechanical response to ensure the integrity of the device. To address this need a set of global/local analysis procedures capable of effectively performing heat conduction and thermomechanical analysis are required. This paper will first overview an overall approach being taken in the development of a set of such procedures. Attention will then focus on the automatic construction, and adaptive finite element analysis of critical local 3-D regions.