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AuthorHarry F. Tiersten, Ting-Leung Sham, B.J. Lwo, Y.S. Zhou, L.-Y. Song, Peggy L. Baehmann, Yannick LeCoz, and Mark S. Shephard
TitleA Global-Local Procedure for the Thermo-elastic Analysis of Multichip Modules
Year1993
JournalConference Proceedings of the 1993 ASME International Electronics Packaging Conference
Volume4-1
Pages103-118
Editor- -
AbstractA global-local procedure for the determination of the thermo-elastic fields in particularly critical regions of multichip modules is presented. In this procedure, a simpler global problem is defined in which layers in the multichip module, which contain metal wires and polymer, are represented as homogeneous effective continua. Some results on the effective properties for the layers are new. This global problem is solved by means of a new variational approximation procedure which is particularly well-suited to layered structures since the number of algebraic equations to be solved does not increase with the number of layers. The displacement field obtained from this global problem is imposed as boundary data on the surface surrounding a critical local region. This local solution is found by means of an adaptive finite element method in which all material constituents and discrete geometry are included. The treatment of a relatively simple three-layer structure with the middle layer containing metal wires and polymer, which can readily be treated by the adaptive finite element method, reveals that the global-local method accurately predicts the local solution. It is also shown that the solution of the global problem obtained by the new variational approximation procedure is very accurate.