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AuthorAntoinette M. Maniatty
TitleStresses inTextured Thin Polycrystalline Films on Substrates
Year1999
JournalProceedings of the Fourth International conference on Constitutive Laws for Engineering Materials
VolumeJuly
Pages229-232
EditorR. C. Picu and E. Krempl
AbstractA model for predicting stresses due to thermal loads in textured thin polycrystalline films on substrates with surface/passivation layers is presented. The model accounts for the behavior of the individual grains and their interactions with the substrate, surface layer, and neighboring gains. Results are presented for an aluminum film on a silicon substrate.