| Author | M.W. Beall, A.Garg, R. Garimella, R. B. Iverson, Y. L. Le Coz, B.-J. Lwo, T-L. Sham, M. S. Shephard, L.-Y. Song and V. S. Wong |
|---|---|
| Title | REPAS - Rensselaer Electronic Packaging Analysis Software Programmer's Manual |
| Year | 1994 |
| Abstract | The analysis of MCM's requires a system of carefully coordinated software to perform thermal, thermomechanical and electromagnetic analyses. The Rensselaer Electronic Packaging Analysis Software (REPAS) is a seamlessly integrated system of thermal and thermomechanical analysis procedures for MCM's, with an interface to an electromagnetic analysis capability. |
| PDF File |  Download |